Product Details

• Latest generation SiC MOSFET chips
• Ultra-low R_Dson
• Low switching losses, Q_g and C_rss
• Low inductance module < 9nH
• T_{vj_op} = 175°C
• 4.2kV DC 1 sec insulation
• Compact design
• Direct cooled PinFin baseplate
• High performance Si₃N₄ ceramic substrates
• Guiding elements for PCB and cooler assembly
• Integrated NTC temperature sensor
• Press-fit contact technology
• RoHS compliant