塑封1200V碳化硅半桥模块,导通电阻为 2mOhm,采用超紧凑直接水冷式设计
| 参数 | 价值 |
|---|---|
| VDSS (at Tj = 25°C) | 1200 V |
| VGSS | -10 to +22 V |
| 最高运行结温 | 175 °C |
MOSFET
| 参数 | 价值 |
|---|---|
| rDSon (at Tj = 25°C) | 2.05 mOhm |
| rDSon (at Tj = 150°C) | 3.8 mOhm |
| 关断损耗 (VCC = 800 V, ID = 520 A, RG = 3 Ω, VGS = -2 / +18 V, Ls = 20 nH, inductive load, Tj = 175°C) | 20 mJ |
| 开通损耗 (VCC = 800 V, ID = 520 A, RG = 3 Ω, VGS = -2 / +18 V, Ls = 20 nH, inductive load, Tj = 175°C) | 13 mJ |
| 参数 | 价值 |
|---|---|
| 正向压降 (ID = -500 A, VGS = 18 V, Tj = 25°C) | 1 V |
| 反向恢复(VR = 800 V, ISD = 500 A, dI/dt = 14 kA/µs, RG = 3 Ω, VGS = -2 / +18 V, Ls = 20 nH, inductive load, Tj = 175°C) | 10.9 mJ |
| 参数 | 价值 |
|---|---|
| 热阻 结点至流体 (Per switch, Coolant 50% glycol, 50% water, 10 l/min, dp < 90 mbar, three modules) | 0.110 K/W |
| 模块自身杂散电感 (per switch) | 4.5 nH |
| 参数 | 价值 |
|---|---|
| 电气间隙 (terminal to base and terminal to terminal) | 7.1 mm |
| Clearance distance in air (terminal to terminal) | 4.0 mm |
| 爬电距离 (terminal to base and terminal to terminal) | 8.0 mm |
| 重量 | 65 g |
Outline
Schematic