塑封1200V碳化硅半桥模块,导通电阻为 2mOhm,采用超紧凑直接水冷式设计
参数 | 价值 |
---|---|
VDSS (at Tj = 25°C) | 1200 V |
VGSS | -10 to +22 V |
最高运行结温 | 175 °C |
MOSFET
参数 | 价值 |
---|---|
rDSon (at Tj = 25°C) | 2.1 mOhm |
rDSon (at Tj = 150°C) | 3.8 mOhm |
关断损耗 (VCC = 800 V, ID = 520 A, RG = 3 Ω, VGS = -2 / +18 V, Ls = 20 nH, inductive load, Tj = 175°C) | 19 mJ |
开通损耗 (VCC = 800 V, ID = 520 A, RG = 3 Ω, VGS = -2 / +18 V, Ls = 20 nH, inductive load, Tj = 175°C) | 17 mJ |
参数 | 价值 |
---|---|
正向压降 (ID = -500 A, VGS = 18 V, Tj = 25°C) | 1 V |
反向恢复(VR = 800 V, ISD = 500 A, dI/dt = 14 kA/µs, RG = 3 Ω, VGS = -2 / +18 V, Ls = 20 nH, inductive load, Tj = 175°C) | 7.7 mJ |
参数 | 价值 |
---|---|
热阻 结点至流体 (Per switch, Coolant 50% glycol, 50% water, 10 l/min, dp < 90 mbar, three modules) | 0.125 K/W |
模块自身杂散电感 (per switch) | 4.5 nH |
参数 | 价值 |
---|---|
电气间隙 (terminal to base and terminal to terminal) | 7.1 mm |
爬电距离 (terminal to base and terminal to terminal) | 8.0 mm |
重量 | 200 g |