SISP0150EP170i20

EP-type H-bridge IGBT power module with rectifier diode

  • i20 ultra-low loss fine pattern Trench IGBT chipset
  • PIM with H-bridge and input rectifier 带 H 桥和输入整流器的 PIM
  • Baseplate isolation with efficient Al2O3 ceramic
  • Cu baseplate for low thermal resistance
  • Industry standard package
EP pic

EP-Type 1.7kV

Parameter Value
Collector-emitter voltage 1700 V
DC collector current​ 150 A
Max. junction operating temperature 175 °C​
Parameter Value
Collector emitter saturation voltage (Tvj = 125°C) 1.85 V
Turn-off energy​ (VCC = 900 V, IC = 150 A, RG = 4.5 Ω, VGE = ± 15 V, Ls = 90 nH, inductive load, Tvj = 125°C) 42 mJ
Turn-on energy​ (VCC = 900 V, IC = 200 A, RG_A1 = 11 Ω, RG_A2 = 6.5 Ω, VGE = ± 15 V, Ls = 90 nH, inductive load, Tvj = 125°C) 58 mJ
Parameter Value
Forward voltage drop (Tvj = 125°C) 1.85 V
Reverse recovery ​(VR = 900 V, IF = 150 A, RG_A1 = 11 Ω, RG_A2 = 6.5 Ω, VGE = ± 15 V, Ls = 90 nH, inductive load, Tvj = 125°C) 30 mJ
Diode rectifier - Forward voltage drop (IF = 150 A, Tvj = 125°C) 1.02 V
Parameter Value
IGBT thermal resistance ​junction to case Rth(j-c)_IGBT 0.144 K/W
Diode thermal resistance junction to case Rth(j-c)_Diode 0.240 K/W
Rectifier thermal resistance junction to case Rth(j-c)_RectifierDiode 0.240 K/W
IGBT thermal resistance case to heatsink Rth(c-s)_IGBT per switch 0.082 K/W
Diode thermal resistance ​case to heatsink Rth(c-s)_Diode per switch 0.090 K/W
Rectifier thermal resistance ​case to heatsink Rth(c-s)_Rectifier 0.156 K/W
Parameter Value
L x W x H 122 x 62.5 x 17 mm³
Clearance distance terminal to base​ 10 mm
Clearance distance terminal to terminal​ 10 mm
Surface creepage distance terminal to base​ 7.5 mm
Surface creepage distance terminal to terminal​ 10 mm
Mass​ 300 g

Outline

Mechanical Properties

Schematics

Outline drawing
DOWNLOADS
  • SISP0150EP170i20v2
    Datasheet
    2026-04-17 | 0.52MB | EN
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  • Chip Position Drawing and Thermal Stack for SISP0150 EP170i20
    Drawing and thermal stack
    2026-04-17 | 0.27MB | EN/CN
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  • Material Content Data Sheet for EP-type
    Material datasheet
    2026-04-17 | 0.07MB | EN/CN
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  • Product Naming Rule Public Article Number directive
    Product Naming Rule Public Article Number directive
    2026-04-17 | 0.66MB | EN
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  • SISP0150EP170i20v2
    产品规格书
    2026-04-17 | 0.62MB | EN/CN
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    ZIP-File
    2026-06-04 | 0MB
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