SISD0900ED170i23 - SwissSEM IGBT power module - dual / phase-leg

Tech-Specs

ED-type phase leg IGBT module

• i23 ultra-low loss micropattern Trench IGBT chipset
• Baseplate isolation with reinforced Al2O3 ceramic
• Cu baseplate for low thermal resistance
• Industry standard package with reduced internal impedance

ED-Type 1.7kV i23

• SISD0900ED170i23

Maximum ratings

Parameter	Value
Collector-emitter voltage	1700 V
DC collector current​	900 A
Max. junction operating temperature​	175 °C

IGBT

Parameter	Value
Collector emitter saturation voltage (Tvj = 125°C)	2.0 V
Turn-off energy​ (VCC = 900 V, IC = 900 A, RG = 1.5 Ω, VGE = ± 15 V, Ls = 35 nH, inductive load, Tvj = 125°C)	256 mJ
Turn-on energy​ (VCC = 900 V, IC = 900 A, RG = 0.5 Ω, VGE = ± 15 V, Ls = 35 nH, inductive load, Tvj = 125°C)	232 mJ

Diode

Parameter	Value
Forward voltage drop (Tvj = 125°C)	2.25 V
Reverse recovery ​(VR = 900 V, IF = 900 A, dI/dt = 9900 A/µs (175°C), RG = 0.5 Ω, VGE = ± 15 V, Ls = 35 nH, inductive load, Tvj = 125°C)	144 mJ

Package Properties

Parameter	Value
IGBT thermal resistance ​junction to case Rth(j-c)_IGBT	0.041 K/W
Diode thermal resistance junction to case Rth(j-c)_Diode	0.069 K/W
IGBT thermal resistance case to heatsink Rth(c-s)_IGBT per switch	0.030 K/W
Diode thermal resistance ​case to heatsink Rth(c-s)_Diode per switch	0.036 K/W

Dimensions

Parameter	Value
L x W x H	152 x 62 x 17 mm³
Clearance distance terminal to base​	12.5 mm​
Clearance distance terminal to terminal​	10 mm​
Surface creepage distance terminal to base​	15 mm​
Surface creepage distance terminal to terminal​	13 mm​
Mass​	350 g

Outline drawing

Outline

Schematics