EP-Type 1.7kV

Tech-Specs

EP-type H-bridge IGBT power module with rectifier diode

  • i20 ultra-low loss fine pattern Trench IGBT chipset
  • PIM with H-bridge and input rectifier 带 H 桥和输入整流器的 PIM
  • Baseplate isolation with efficient Al2O3 ceramic
  • Cu baseplate for low thermal resistance
  • Industry standard package
EP pic
Maximum ratings

Parameter Value
Collector-emitter voltage 1700 V
DC collector current​ 100 A
Max. junction operating temperature 175 °C​
IGBT

Parameter Value
Collector emitter saturation voltage (Tvj = 125°C) 1.85 V
Turn-off energy​ (VCC = 900 V, IC = 100 A, RG = 4.5 Ω, VGE = ± 15 V, Ls = 90 nH, inductive load, Tvj = 125°C) 39 mJ
Turn-on energy​ (VCC = 900 V, IC = 100 A, RG_A1 = 11 Ω, RG_A2 = 6.5 Ω, VGE = ± 15 V, Ls = 90 nH, inductive load, Tvj = 125°C) 94 mJ
Diode

Parameter Value
Forward voltage drop (Tvj = 125°C) 1.85 V
Reverse recovery ​(VR = 900 V, IF = 100 A, RG_A1 = 11 Ω, RG_A2 = 6.5 Ω, VGE = ± 15 V, Ls = 35 nH, inductive load, Tvj = 125°C) 23 mJ
Diode rectifier - Forward voltage drop (IF = 150 A, Tvj = 125°C) 1.02 V
Package Properties

Parameter Value
IGBT thermal resistance ​junction to case Rth(j-c)_IGBT 0.200 K/W
Diode thermal resistance junction to case Rth(j-c)_Diode 0.320 K/W
Rectifier thermal resistance junction to case Rth(j-c)_RectifierDiode 0.280 K/W
IGBT thermal resistance case to heatsink Rth(c-s)_IGBT per switch 0.089 K/W
Diode thermal resistance ​case to heatsink Rth(c-s)_Diode per switch 0.099 K/W
Rectifier thermal resistance ​case to heatsink Rth(c-s)_Rectifier 0.159 K/W
Dimensions

Parameter Value
L x W x H 122 x 62.5 x 17 mm³
Clearance distance terminal to base​ 10 mm
Clearance distance terminal to terminal​ 10 mm
Surface creepage distance terminal to base​ 7.5 mm
Surface creepage distance terminal to terminal​ 10 mm
Mass​ 300 g
Mechanical Properties

Outline

Mechanical Properties
Outline drawing

Schematics

Outline drawing