EVD-type

Tech-Specs

EVD-Type three-phase 1.2kV Si-IGBT automotive power-module

  • i25 generation Si-IGBT chips
  • Low switching losses
  • Low inductance module < 9nH
  • Tvj_op = 175°C
  • 4.2kV DC 1 sec insulation
  • Compact design
  • Direct cooled PinFin baseplate
  • High performance Si3N4 ceramic substrates
  • Guiding elements for PCB and cooler assembly
  • Integrated NTC temperature sensor
  • Solder pin to PCB contact technology
  • RoHS & REACH compliant
EVD Si C type photo
Maximum ratings

Parameter Value
VCES (at Tj = 25°C) 1200 V
Max. junction operating temperature 175 °C
IGBT

Parameter Value
VCEsat at Tvj = 150 °C 1.6 V
Eoff (at VCC = 600 V, IC = 600 A, RG = TBD, VGE = 15 V, Ls = 35 inductive load, Tj = 150°C) 59 mJ
Eon (at VCC = 600 V, IC = 600 A, RG = TBD, VGE = 15 V, Ls = 35 inductive load, Tj = 150°C) 49 mJ
Diode

Parameter Value
Forward voltage VF (IF = 450A, Tvj = 150 °C) 1.9 V
Erec (at VCC = 600 V, IC = 600 A, RG = TBD, VGE = 15 V, Ls = 35 inductive load, Tj = 150°C) 32 mJ
Package Properties

Parameter Value
Thermal resistance junction to fluid (Per switch, Coolant 50% glycol, 50% water, 10 l/min, dp < 90 mbar) 0.11 K/W
Module stray inductance (per switch) 8.5 nH
Dimensions

Parameter Value
Clearance distance in air (terminal to base and terminal to terminal) 4.5 mm
Surface creepage distance (terminal to base and terminal to terminal) 9.0 mm
Mass 720 g
Outline drawing

Outline

Outline drawing

Schematics

Outline drawing