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SwissSEM
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SIS0300C175i23 SwissSEM IGBT die for power module assembly

1700V and 300A rated IGBT-die with i23-technology featuring a fine pattern trench cell

IGBT 1.7kV

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  • SIS0300C170i23
    Datasheet
    2025-08-15 | 0.38MB | EN/CN
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  • Product Naming Rule Public Article Number directive
    Product Naming Rule Public Article Number directive
    2025-10-31 | 0.66MB | EN
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    ZIP-File
    2025-10-31 | 0.96MB
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