Features
Product Details
- Latest generation SiC MOSFET chips
- Ultra-low RDson
- Low switching losses, Qg and Crss
- Low inductance module < 9nH
- Tvj_op = 175°C
- 4.2kV DC 1 sec insulation
- Compact design
- Direct cooled PinFin baseplate
- High performance Si3N4 ceramic substrates
- Guiding elements for PCB and cooler assembly
- Integrated NTC temperature sensor
- Press-fit contact technology
- RoHS compliant
