SISP0200EP170i20

SISP0200EP170i20 - SwissSEM EP-type H-bridge IGBT power module

  • i20超低损耗精细沟槽栅型IGBT芯片组
  • 带 H 桥和输入整流器的 PIM
  • 高效Al2O3 绝缘陶瓷基板
  • 低热阻铜底板
  • 行业标准封装
EP pic

EP-Type 1.7kV

参数 价值
集电极-发射极电压 1700 V
集电极直流电流 200 A
最高运行结温 175 °C​
参数 价值
集电极-发射极饱和电压 (Tvj = 125°C) 1.85 V
关断损耗​ (VCC = 900 V, IC = 200 A, RG = 3 Ω, VGE = ± 15 V, Ls = 90 nH, inductive load, Tvj = 125°C) 58 mJ
开通损耗​ (VCC = 900 V, IC = 200 A, RG_A1 = 5 Ω, RG_A2 = 2 Ω, VGE = ± 15 V, Ls = 90 nH, inductive load, Tvj = 125°C) 94 mJ
参数 价值
正向压降 (Tvj = 125°C) 1.85 V
反向恢复 ​(VR = 900 V, IF = 200 A, RG_A1 = 5 Ω, RG_A2 = 2 Ω, VGE = ± 15 V, Ls = 90 nH, inductive load, Tvj = 125°C) 64 mJ
Diode rectifier - Forward voltage drop (IF = 150 A, Tvj = 125°C) 1.02 V
参数 价值
IGBT结-壳热阻 Rth(j-c)_IGBT 0.120 K/W
二极管结-壳热阻 Rth(j-c)_Diode 0.210 K/W
Rectifier thermal resistance junction to case Rth(j-c)_RectifierDiode 0.250 K/W
IGBT壳到散热器热阻 Rth(c-s)_IGBT per switch 0.073 K/W
二极管壳到散热器热阻 Rth(c-s)_Diode per switch 0.083 K/W
Rectifier thermal resistance ​case to heatsink Rth(c-s)_Rectifier 0.143 K/W
参数 价值
长 x 宽 x 高 122 x 62.5 x 17 mm³
电气间隙-端子到基板 10 mm
电气间隙-端子到端子 10 mm
爬电距离-端子到基板 7.5 mm
爬电距离-端子到端子 10 mm
重量 300 g

Outline

Outline drawing

Schematics

Outline drawing
下载
  • SEM DS 0029 SISP0200 EP170i20 v2 0en
    2026-06-23 | 0.5MB | EN
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  • SEM AN 25 0007 Chip Position Drawing and Thermal Stack for SISP0200 EP170i20
    2026-06-23 | 0.27MB
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  • Material Content Data Sheet for EP type
    2026-06-23 | 0.07MB
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  • SEM AN 25 0003 SISP0xxx EP1yyi2z CN v1 0
    2026-06-23 | 0.7MB
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  • AN 000011 L Product Naming Rule Public Article Number directive
    2026-06-23 | 0.66MB
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  • SEM DS 0029 SISP0200 EP170i20 v2 0
    2026-06-23 | 0.58MB | EN/CN
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  • 下载所有
    ZIP文件
    2026-06-23 | 2.54MB
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