SCSD0011XP230m23

XP-Type phase leg SiC MOSFET module

  • m23 generation SiC MOSFET chips; m23 SiC MOSFET with ultra-low RDSon
  • 2000 A implemented current
  • Baseplate isolation with low Rth Si3N4 ceramic
  • Cu baseplate for low thermal resistance
  • Industry standard package with reduced internal impedance
XP almost clean

XP-type 2.3kV m23

Parameter Value
Drain-source breakdown voltage V(BR)DSS 2300 V
Continuous drain and source current 1350 A
Max. junction operating temperature 175 °C​

MOSFET

Parameter Value
Static drain-source on-state resistance RDSon (ID = 2000A, VGS = 18V, Tvj = 25°C) 1.1 mOhm
Turn-off switching energy - Eoff (VCC = 1500V, ID = 2000A, RG = Ohm, VGS = -5V/+18V, Tvj = 125°C) 400 mJ
Turn-on switching energy - Eon (VCC = 1500V, IC = 2000A, RG = Ohm, VGS =-5V/+18V, Tvj = 125°C) 470 mJ
Drain-source reverse voltage - VDS (ID = -2000A, VGS = -5V, Tvj = 25°C) 5.5 V
MOSFET Forward Recover Energy - Err (VR = 1500V, ID = 2000A, RG = Ohm, VGS = -5/+18V, Tvj = 125°C) mJ
Parameter Value
Thermal resistance junction to case Rth(j-c) 0.018 K/W
Thermal resistance case to heatsink Rth(c-s) 0.012 K/W
Parameter Value
L x W x H 140 x 100 x 40 mm³
Mass​ 1100 g

Outline

Outline drawing

Schematics

Outline drawing
DOWNLOADS
  • SCSD0011XP230m23v2
    Datasheet
    2026-09-17 | 0.36MB | EN
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  • AN 000011 L Product Naming Rule Public Article Number directive
    2026-09-22 | 0.66MB
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  • SCSD0011XP230m23v2
    Datasheet
    2026-09-17 | 0.44MB | EN/CN
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    ZIP-File
    2026-09-22 | 1.32MB
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