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SIS0330C140i25 SwissSEM IGBT die for power module assembly

1400V and 330A rated IGBT-die with i25-technology featuring a micro pattern trench cell

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SIS0330C140i25

Silicon IGBT 1400 V and 330 A rated current

i25 ultra-low-loss micro pattern Trench IGBT chipset
Soft switching for a broad application range due to best turn-off controllability
positive temperature coefficient
easy paralleling

I20 21

IGBT 1.4kV i25-technology

Parameter	Value
Collector-emitter voltage	1400 V
DC collector current	330 A

Parameter	Value
Length	16.35 mm
Width	12.36 mm

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