SISD0450ED170i20_A01

ED-type phase leg IGBT module

  • i20 ultra-low loss fine pattern Trench IGBT chipset
  • Baseplate isolation with reinforced Al2O3 ceramic
  • Cu baseplate for low thermal resistance
  • Improved Package with reduced internal impedance and terminal heating
SISD0900 ED120i23 photo

ED-Type 1.7kV i20

Parameter Value
Collector-emitter voltage 1700 V
DC collector current​ 450 A
Max. junction operating temperature​ 175 °C
Parameter Value
Collector emitter saturation voltage (Tvj = 125°C) 2.0 V
Turn-off energy​ (VCC = 900 V, IC = 450 A, RG = 2 Ω, VGE = ± 15 V, Ls = 35 nH, inductive load, Tvj = 125°C) 134 mJ
Turn-on energy​ (VCC = 900 V, IC = 450 A, RG = 2 Ω, VGE = ± 15 V, Ls = 35 nH, inductive load, Tvj = 125°C) 151 mJ
Parameter Value
Forward voltage drop (Tvj = 125°C) 1.95 V
Reverse recovery ​(VR = 900 V, IF = 450 A, dI/dt = 8220 A/µs (175°C), RG = 2 Ω, VGE = ± 15 V, Ls = 35 nH, inductive load, Tvj = 125°C) 91 mJ
Parameter Value
IGBT thermal resistance ​junction to case Rth(j-c)_IGBT 0.060 K/W
Diode thermal resistance junction to case Rth(j-c)_Diode 0.106 K/W
IGBT thermal resistance case to heatsink Rth(c-s)_IGBT per switch 0.032 K/W
Diode thermal resistance ​case to heatsink Rth(c-s)_Diode per switch 0.039 K/W
Parameter Value
L x W x H 152 x 62 x 17 mm³
Clearance distance terminal to base​ 12.5 mm​
Clearance distance terminal to terminal​ 10 mm​
Surface creepage distance terminal to base​ 15 mm​
Surface creepage distance terminal to terminal​ 13 mm​
Mass​ 350 g

Outline

Outline drawing

Schematics

Outline drawing
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    Datasheet
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    Chip position drawing
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  • SISD0450 ED170i20 package v1 0
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  • SISD0450ED170i20_A01v2
    产品规格书
    2026-06-25 | 0.63MB | EN/CN
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