SISD1800XP170i23

XP-type phase-leg IGBT power module

  • i23 ultra-low loss micro pattern Trench IGBT chipset
  • Baseplate isolation with low Rth Si3N4 ceramic
  • Cu baseplate for low thermal resistance
  • Industry standard package with reduced internal impedance
XP almost clean

XP-type 1.7kV i23

Parameter Value
Collector-emitter voltage 1700 V
DC collector current 1800 A
Max. junction operating temperature 175 °C​
Parameter Value
Collector(-emitter) breakdown voltage VCEsat (IC = 1800A, VGS = 15V, Tvj = 25°C) 1.75 V
Turn-off switching energy - Eoff (VCC = 900V, IC = 1800A, RG = 0.5 Ohm, VGS = +/-15V, Tvj = 125°C) 560 mJ
Turn-on switching energy - Eon (VCC = 900V, IC = 1800A, RG = 0.5 Ohm, VGS = +/-15V, Tvj = 125°C) 510 mJ
Parameter Value
Forward voltage VF (IC = 1800A, Tvj = 25°C) 2 V
Reverse Recover Energy - Err (VCC = 900V, IC = 1800A, RG = 0.5 Ohm, VGS = +/-15V, Tvj = 125°C) 280 mJ
Parameter Value
IGBT thermal resistance ​junction to case Rth(j-c)_IGBT 0.016 K/W
Diode thermal resistance junction to case Rth(j-c)_Diode 0.027 K/W
IGBT thermal resistance junction to case Rth(c-s)_IGBT 0.0144 K/W
Diode thermal resistance junction to case Rth(c-s)_Diode 0.0172 K/W
Parameter Value
L x W x H 140 x 100 x 40 mm³
Mass​ 1100 g

Outline

Outline drawing

Schematics

Outline drawing
DOWNLOADS
  • SISD1800XP170i23v2
    Datasheet
    2026-09-17 | 0.34MB | EN
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  • AN 000011 L Product Naming Rule Public Article Number directive
    2026-09-22 | 0.66MB
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  • SISD1800XP170i23v2
    Datasheet
    2026-09-17 | 0.43MB | EN/CN
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    ZIP-File
    2026-09-22 | 1.29MB
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